发明名称 SURFACE TREATING METHOD FOR SEMICONDUCTOR SUBSTRATE
摘要 PURPOSE:To treat the whole surface of a semiconductor substrate uniformly by little HMDS by treating the surface of the semiconductor substrate by HMDS vapor formed by natural evaporation in an evaporator with an evaporation-area spreading member. CONSTITUTION:Hexamethyldisilazane (HMDS) vapor is formed by natural evaporation in an evaporator 3 with evaporation-area spreading members 8-10, which have a function, in which an HMDS liquid 5 is sucked up by a capillary phenomenon, and one parts of which are positioned in the HMDS liquids 5 and the other parts of which are positioned outside the HMDS liquids 5. The surface of a semiconductor substrate S is treated by HMDS vapor shaped in said evaporator 3. Nitrogen gas N2 flowing into a partitioning chamber 11a from an inlet port 4a for the evaporator 3 passes through clearances 12a-12c in succession and flows in each partitioning chamber 11a-11d, and includes a sufficient quantity of HMDS vapor and flows out to an HMDS vapor line 6 from an outlet port 4b. HMDS vapor flows into a reaction vessel 15 from an inlet port 15a, and the surface of the semiconductor substrate S is treated with HMDS vapor.
申请公布号 JPS63199423(A) 申请公布日期 1988.08.17
申请号 JP19870032859 申请日期 1987.02.16
申请人 TOSHIBA CORP 发明人 IMOTO YUKIO
分类号 G03C1/74;G03F7/00;G03F7/16;G03F7/26;H01L21/027;H01L21/30 主分类号 G03C1/74
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