| 摘要 |
PURPOSE:To obtain the titled composition capable of providing laminated boards having excellent dielectric characteristics, heat and solvent resistance as well as high glass transition point, by adding tetrabromobisphenol A and a specific acrylic compound as a curing agent to an epoxidized polybutadiene. CONSTITUTION:The aimed composition obtained by blending (A) 100pts.wt. epoxidized butadiene polymer prepared by epoxidizing a butadiene polymer having 500-5,000 molecular weight and <=50%, 1,2-type double bond content so as to provide 0.3mol./100g epoxy group content with (B) 20-100pts.wt. tetrabromobisphenol A and (C) 20-100pts.wt. (meth)acrylic compound expressed by the formula (R1 and R2 are H or methyl; n is 0-5). Furthermore, the curing agent (B) may be partially replaced with a novolak type phenolic resin, etc., and the curing agent (C) may be partially replaced with (meth)acrylic monomer. A catalyst such as tertiary amine, etc., reaction accelerator such as peroxide, etc., can also be added to the above-mentioned composition.
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