发明名称 Cooled component assembly
摘要 A component assembly is provided comprising a housing having connector means extending externally thereof, locating means mounted in the housing, a plurality of components located by said locating means, the components being connected to one another and to said external connector means, and a heat sink material comprising a particulate microcrystalline material such as diamond and a filler material such as a fluorocarbon or paraffin, said heat sink material filling said housing and being in heat transfer relation to said components.
申请公布号 US4764845(A) 申请公布日期 1988.08.16
申请号 US19870029599 申请日期 1987.03.24
申请人 ARTUS, RAYMONDE G. C. 发明人 ARTUS, RAYMONDE G. C.
分类号 H01L23/373;H01L23/42;H05K5/00;H05K7/20;(IPC1-7):H05K7/20 主分类号 H01L23/373
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