| 摘要 |
The present invention provides a photosensitive resin composition comprising (a) 10-60 wt. % of a styrene-maleic acid copolymer or its partially esterified product having a molecular weight of 1,000-3,000 and an acid value of 50-500, (b) 1-30 wt. % of acrylate or methacrylate having a tetrahydrofurfuryl group or a hydroxyl group, (c) 1-30 wt. % of diacrylate or dimethacrylate of polyethyleneglycol or polypropylene glycol, (d) 1-40 wt. % of a monoester compound represented by the following general formula (I), (II), (III), (IV) or (V). <IMAGE> (I) <IMAGE> (II) <IMAGE> (III) <IMAGE> (IV) <IMAGE> (V) (wherein, X stands for a divalent organic group, preferably an alkylene group having carbon atoms of 1-4 or -CnH2nO-p CH2 group wherein n is an integer of 2-6 and p is an integer of 1-19; Y stands for hydrogen atoms or a methyl group; and Y' stands for hydrogen atoms or an alkyl group having carbon atoms of 1-4.).
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