| 摘要 |
A process of producing plastic-molded printed circuit boards by injection-molding a heat resistant plastic to form a plastic molding having many perforations and forming a conductive layer on the molding, which comprises molding the heat resistant plastic using a mold for injection-molding obtained by preparing a die set for injection-molding composed of a fixed side metal platen having at least an inlet for molten resin and forming a space for installing mold part(s), a stripper metal platen having, if necessary, an inlet for molten resin connected to the fixed side metal platen and forming a space for installing mold part(s), and a movable side metal platen forming a space for installing mold part(s); and assembling a pair of molds composed of a mold I having a concaved portion for cavity and a mold II having perforations for passing hard pins for forming holes and, if desired, a concaved portion for cavity, said molds being formed by a cured resin composition or a composite of a metal and a cured resin composition, and a hard pin mold III having hard pins for forming holes fixed thereto in such a manner that (a) the mold I is fixed to the fixed side metal platen, the mold II is fixed to the stripper metal platen, and the hard pin mold III is fixed to the movable side metal platen in this order, or (b) the hard pin mold III is fixed to the fixed side metal platen, the mold II is fixed to the stripper metal platen, and the mold I is fixed to the movable side metal platen in this order.
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