| 摘要 |
A sintered glass-powder product of a glass ceramic body, consisting essentially of: SiO2, Al2O3, MgO, and B2O3, and sintered at a temperature below 900 DEG C. The product includes a microstructure of alpha-cordierite and magnesium aluminum silicate (MgO.Al2O3.4SiO2) homogeneously dispersed in the glass ceramic body. When the sintered glass-powder product is used in the form of a green sheet for fabricating, in particular, a multilayer wiring substrate or the like, the required sintering temperature for fabricating the substrate can be remarkably reduced so as to be well-matched in thermal characteristics with such wiring conductors as gold, silver, copper, or the like, and even with a relatively large semiconductor chip because the thermal expansion coefficient of the sintered product is close to that of silicon semiconductor.
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