| 摘要 |
PURPOSE:To attain firm adhesion and improved heat conduction by uniting an In-Sn target for sputtering and a backing plate to one body by bonding with In- Sn solder. CONSTITUTION:The backing plate 1 has a coating layer 2 of Ni, Co, Cr or the like which is hardly alloyed with In-Sn. A layer 4 of In-Sn solder is formed on the layer 2 by wet plating, PVD, application or other method, and the In-Sn target 5 for sputtering is placed on the layer 4. They are pressed tightly in the air and heated in vacuum or in the air. The layer 4 of In-Sn solder is melted by the heating to bond the target 5 to the plate 1, and a bonded target T is manufactured. |
