| 摘要 |
PURPOSE:To obtain the titled iron-nickel alloy having stable solder wettability and capable of sufficiently complying with a recent demand of the reduction in chlorine content in a soldering flux, by providing a composition in which Cr content is limited to the prescribed quantity or below and Si, Mn, and Al contents are also limited to the prescribed ranges, respectively. CONSTITUTION:In an iron-nickel alloy for lead frames containing, by weight, 35-60% Ni, contents of component elements are regulated so that Cr is limited to <=0.1% and further Si, Mn, and Al are also limited to 0.01-0.5%, 0.01-1.0%, and 0.001-0.05%, respectively. The resulting alloy has the above-mentioned characteristics as lead frame material for semiconductor device and shows extremely high reliability.
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