发明名称 METHOD FOR REMOVING METAL DEPOSITED ON CONDUCTOR ROLL FOR HORIZONTAL ELECTROPLATING DEVICE
摘要 PURPOSE:To appropriately and uniformly remove only deposited metal and to reduce power loss, by bringing a metal member electrochemically nobler than a plating metal into contact with conductor roll, and allowing an acidic soln. to pass through a recess between both the member and the roll. CONSTITUTION:A material 3 to be plated is negatively charged and supported by the conductor roll 5 to be brought into contact with a plating soln. 7 and a backup roll 5 in an electrolytic cell 2, and horizontally traveled in the plating soln. 7. Electrodes 4 and 4' are vertically opposed to each other in the electrolytic cell 2, and used as the anodes. A current is applied through the plating soln. 7, and the material 3 is electroplated. In such a horizontal electroplating device 1, the roll-shaped metallic member 13 with the surface consisting of a metal electrochemically nobler than the plating metal is brought into control with the part of the conductor roll 5 being in no contact with the plating soln. 7. An acidic soln. is then poured from a nozzle device 15 into the recess by both rolls. As a result, a local cell cell is formed, and the plating metal deposited on the conductor roll 5 is dissolved and removed.
申请公布号 JPS63195293(A) 申请公布日期 1988.08.12
申请号 JP19870027671 申请日期 1987.02.09
申请人 NKK CORP 发明人 SAGIYAMA MASARU;KAWABE MASAKI;TSUJIHARA TOSHIYUKI;TAKUSHIMA SHIGEHIRO
分类号 C25D7/06 主分类号 C25D7/06
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