| 摘要 |
PURPOSE:To make it possible to form a film having adhesion by electroless plating, by striking the surface of a material such as an Fe-Ni alloy, soft-etching it and immersing the material in a reducing agent soln. CONSTITUTION:The surface of the material consisting of an Fe-Ni alloy or an Fe-Ni base alloy is degreased, striked with copper or the like and moderately roughened by soft etching with an aq. ammonium persulfate soln. or the like. The material is then immersed in a reducing agent soln. such as an aq. formaldehyde soln. to clean the surface and to increase the activity. The reducing agent and a reducing agent used in electroless plating are of the same kind. By this pretreatment, reducing action during electroless plating can be made uniform and rapid. |
