| 摘要 |
PURPOSE:To obtain the titled composition, having excellent toughness, heat and impact resistance, flexibility, etc., and capable of providing molded articles suitable as electrical and electronic parts, etc., by compression, injection molding methods, etc., by reacting a specific biphenylbismaleimide with a diamine compound. CONSTITUTION:The aimed composition obtained pulverizing and blending (A) N,N-bis(4-aminophenoxy)biphenylbismaleimide, expressed by formula I and prepared by subjecting 4,4-bis(4-aminophenoxy)biphenyl and maleic anhydride to condensation and dehydration reaction with (B) a diamine compound, expressed by formula II (R is formula III, etc.) [e.g. 1,3-bis(3-aminophenoxy) benzene, etc.] and obtained by condensing bisphenols with m-dinitrobenzene in, e.g. solid forms, and heat-treating the resultant blend at 70-220 deg.C.
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