| 摘要 |
<p>A ball bonding process, in particular a gold wire bonding process comprises the following steps: locating and lowering a bond-capillary (10) with a flaming bonding wire ball (12) from an elevated initial position to a first bonding point (17); welding the bonding wire ball (12) with heat, defined pressure and/or ultra-sound; lifting the bond-capillaries (10); loop building (21); welding the bonding wire (11) in a second bonding point (16) with heat, defined pressure and/or ultra-sound; lifting the bond-capillaries (10) to a tail length position (28) and tearing off the bonding wire (11) by pulling it with a clip (13) that clamps the bonding wire (11) and flaming the free extremity of the bonding wire, thus forming a bonding wire ball (12). In order to precisely locate a flaming device with respect to the free extremity of the bonding wire to be flamed, the distance covered by the wire clip (13) before the bonding wire (11) breaks is measured and the flaming device (flaming lance 18) is adjusted according to that measurement, or the distance between the flaming device (18), and the free tip of the wire after the bonding wire is broken off is precisely adjusted.</p> |
