CLADDING OF SUBSTRATES WITH THICK METAL CIRCUIT PATTERNS

摘要

A method for forming a circuit on a surface of an insulating substrate (10) comprises the steps of adhering Angstroms thick metallization (16) to the surface of the insulating substrate, placing conductive material (24) on the metallization through a photoresist pattern (20) of the circuit, stripping the resist pattern from the substrate, and removing the metallization not covered by the circuit of the conductive material by use of the conductive material as a resist.