发明名称 METHOD OF ADHESION AND COMPOSITION THEREFOR
摘要 <p>A method of adhesion which comprises applying a two-step reactive type tacky adhesive agent comprising (1) a non-photopolymerizable epoxy resin or isocyanate compound, (2) a curing agent therefor and (3) a compound having at least one photopolymerizable vinyl group in one molecule onto a substrate, irradiating the whole applied surface with light to develop the tackiness, and sticking the substrate together to a material to be bonded, while the tackiness is retained, followed by curing. The method provides excellent green bonding strength and can permit the satisfactory adhesion without clamping, and can be particularly suitably utilized in the adhesion of materials to be bonded which have a curved surface difficult to be clumped.</p>
申请公布号 DE3563632(D1) 申请公布日期 1988.08.11
申请号 DE19853563632 申请日期 1985.02.12
申请人 TAKEDA CHEMICAL INDUSTRIES, LTD. 发明人 NAKAI, YOSHIKAZU;KUBOTA, TSUTOMU
分类号 C08G18/63;C09J5/00;C09J163/00;C09J175/04;C09J175/16;(IPC1-7):C09J5/00 主分类号 C08G18/63
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