CERAMIC SUBSTRATE WITH CONDUCTIVELY-FILLED VIAS AND METHOD FOR PRODUCING

摘要

A ceramic substrate (10) having vias (16) filled with a conductive material (18) which forms a hermetic seal for the vias. The conductive material (18) in the vias is the sintered product of a powder mixture comprising a metal, preferably tungsten, and a ceramic powder, preferably alumina. The conductive material (18) in the via has a resistance less than about 0.5 ohms. The conductive material (18) forms a seal sufficient to provide a leakage rate of less than 1.0 x 10<-8> STD cc per second of helium at a one atmosphere differential.