| 摘要 |
PURPOSE:To enable paste to be applied uniformly on packages and to improve reliability of semiconductor products, by moving a needle vertically along the surface of a package by means of a profiling mechanism section so as to hold a distance between the tip end of the needle and the paste applied surface of the package at a fixed level. CONSTITUTION:A Z-axis arm 9 connected to a drive section supports a paste supply section 3 having a needle 2 provided at the tip end thereof, through a profiling mechanism 12. In order to apply paste on a package 11, a roller bearing 14 is rotatably contacted with the surface of the package while it is moved vertically, following the inclination or undulation of the surface of the package 11. Thus, the roller bearing 14 can be moved along X- and Y-axes without leaving from the surface of the package 11. Simultaneously therewith, the paste holding section 3 and hence the needle 3 are moved vertically by means of the profiling mechanism 12 against the elastic force of a spring 18. In this manner, a distance between the tip end of the needle and the paste applied surface can be always held at a fixed level.
|
