发明名称 |
ALPHA-PARTICLE PROTECTION IN INTEGRATED CIRCUIT PACKAGES |
摘要 |
A structure for use in the fabrication of integrated circuit packages includes an insulating film having a hole and a plurality of conductors on the film that extend in a cantilevered fashion into the hole and terminate therein such that their ends align with the perimeter of a predetermined area within the hole; and a piece of alpha-particle shielding material has a body which lies within the area and has arms that extend from the body beyond the area and attach to the film or the conductors or both to hold the body in place. |
申请公布号 |
DE3377313(D1) |
申请公布日期 |
1988.08.11 |
申请号 |
DE19833377313 |
申请日期 |
1983.08.02 |
申请人 |
BURROUGHS CORPORATION (A DELAWARE CORPORATION) |
发明人 |
FIRTH, HORACE ALLEN |
分类号 |
H01L23/28;H01L21/60;H01L23/556 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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