HOLLOW MULTILAYER PRINTED WIRING BOARD, AND METHOD OF FABRICATING SAME

摘要

PCT No. PCT/JP80/00111 Sec. 371 Date Jan. 24, 1981 Sec. 102(e) Date Jan. 16, 1981 PCT Filed May 23, 1980 PCT Pub. No. WO80/02633 PCT Pub. Date Nov. 27, 1980.A hollow multilayer printed wiring board and a process for manufacturing the same are provided. The hollow multilayer printed wiring board is comprised of a plurality of printed substrates (1), (2), (3) and (4), superposed upon each other with a predetermined space therebetween each of which substrate has a signal conductor pattern (6) formed on at least one surface thereof and a land conductor pattern (7) formed on at least one surface thereof. Each substrate has plated throughholes (10) in the land conductor pattern, each of which holes is in line with another plated throughhole of at least one of the neighboring substrates to form a throughhole or an interstitial via hole (12) or (13). A layer of a low melting point metal is formed at least on the upper and lower end surfaces of each plated throughholes (10), which layer serves as a through connection between two or more signal conductor patterns of the substrates and as an interlayer adhesion between the substrates. The superposed substrates, except for at least one surface substrate, are made of a thermally resistant organic synthetic resin sheet or an insulation-treated metal.