| 摘要 |
PURPOSE:To fix an optical fiber with high accuracy by providing a leading-in hole for leading a low melting point metal for fixing the optical fiber which has reached a through-hole and formed and method, into the through-hole, on the upper part of an optical fiber fixing base. CONSTITUTION:A chip fixing base 12 and an optical fiber fixing base 13 are provided on each opposed position on a sub-mount substrate 11, and to the chip fixing base 12, a semiconductor laser chip 15 is fixed through a radiation use heat sink 14, and a light emitting part 15-1 is provided in front of the chip 15. In a position opposed to the chip 15, a hole 16 passing through the fixing base 13 is formed, and its center axis coincides with the light emitting part 15-1. In the through hole 16, a leading-in hole 17 is formed, and in the end part of the leading-in hole 17, a chamfered part 17-1 is formed. The through-hole 16, the leading-in hole 17 and its chamfered part 17-1 are filled with solder 18 of a low melting point, an optical fiber 19 is fixed by passing through the center part of the solder 18 in the through-hole 16, and a position to the light emitting part 15-1 of the optical fiber 19 is adjusted so that the maximum coupling efficiency can be obtained.
|
