| 摘要 |
PURPOSE:To perform lift-off without contact with a wafer, by performing vacuum sucking of the selective separation of a thin metal film on a photoresist. CONSTITUTION:A wafer 11 is mounted on a stage 10 and closely contacted with a wafer sucking hole 12. Then a valve 15 is opened. Air between a sucking hole 14 and the wafer 11 is quickly exhausted through a pipe 16 with a pump 17 at the exhausting amount of 150-1,000 l/min, and a thin metal film on photoresist is sucked and selectively separated. Thus lift-off is performed. In this way, lift-off is performed without contact with the wafer 11.
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