发明名称 WAFER TRANSFER APPARATUS
摘要 PURPOSE:To omit rolling parts and sliding parts and to prevent dust yielding at movable parts, by alternately expanding and contracting first and second piezoelectric elements, and transferring a wafer, which is mounted on a wafer transfer stage, in the horizontal direction. CONSTITUTION:When a first piezoelectric element 11 is elongated in the vertical direction and a wafer supporting stage 7 is moved upward, a wafer 5 is mounted on the wafer supporting stage 7 and separated from a transfer stage 8. When a second piezoelectric element 13 is contracted in the horizontal direction, the transfer stage 8 is moved leftward. The supporting stage 7 is moved downward by contracting the element 11, and the wafer 5 is mounted on the transfer stage 8. The element 13 is elongated, and the transfer stage 8 and the wafer 5 thereon are sent rightward. Thus a rolling part and a sliding part are omitted, and dust yielding from movable parts is eliminated.
申请公布号 JPS63193542(A) 申请公布日期 1988.08.10
申请号 JP19870026578 申请日期 1987.02.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIKAWA TOSHIKI;NISHIDA YOSHIHIDE
分类号 B65G27/24;B65G49/07;B65H5/00;H01L21/677;H01L21/68;H02N2/00 主分类号 B65G27/24
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