发明名称 METHOD FOR CONNECTING LEADLESS CHIP PACKAGES AND ARTICLES
摘要 Leadless chip package (10) is adhesively secured to printed wiring board (14) and is electrically connected by metallic conductor ribbon or wire (40, 42, 44...) to pads (30, 32, 34, 36) on the package (10) and pads (16, 18, 20, 22...) on the printed wiring board (14) to provide secure connection.
申请公布号 AU1184388(A) 申请公布日期 1988.08.10
申请号 AU19880011843 申请日期 1988.01.21
申请人 HUGHES AIRCRAFT COMPANY 发明人 PHILIP V. PESAVENTO
分类号 H01L21/603;H01L21/60;H01L21/607;H05K1/18;H05K3/30;H05K3/32 主分类号 H01L21/603
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