| 摘要 |
PURPOSE:To improve operating efficiency, by numerically indicating the driving amount of a chuck, on which a wafer is mounted, in the up and down directions, and aligning the positions of a chip on the wafer and a probe based on the indication. CONSTITUTION:A microcomputer 17 is provided with an operating part 18. The operating part 18 operates the driving amount of a chuck 2 in the direction Z based on the amount of rotation of a step motor 11. A display part 19 is provided to an operating panel (a) on the front surface of a prober. The driving amount in the direction Z, which is operated in the operating part 18, is numerically displayed as a distance from a reference point. The reference point is made to be, e.g., the lowest level of the chuck 2. The increased amount of the chuck 2 is displayed in 1/100 cm unit. When the operator has lifted the chuck 2 to a specified value, the operator conducts the alignment in the horizontal direction by confirming it through microscope. The chuck 2 is further lifted and a wafer 1 on the chuck 2 is contacted with a probe. Thus operating efficiency is improved.
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