| 摘要 |
<p>Syrup wafers with syrup between the upper and lower parts of the wafer are produced by injecting the syrup between the non-separated wafer halves during or immediately after the baking of the wafers, and then, when necessary, closing the opening through which the syrup is injected by further baking. The method enables syrup wafers to be continuously and automatically produced with a minimum use of manual operations. The waste material produced when the wafers are formed by stamping is avoided. A thin syrup can be used, instead of the thick syrup formerly used, which tended to provide tough syrup wafers.</p> |
