| 摘要 |
PURPOSE:To obtain a semiconductor product, the thickness of an intermetallic compound of which is hardly dispersed and which has high reliability, by forming the sectional shape of a heating block to a recessed shape, in which both end sections are made higher than a central section, floating a frame hold-down from the heating block on the stoppage of a device and separating a lead frame from the heating block. CONSTITUTION:The sectional shape of a heating block 5 supplying a lead frame 1 with heat is formed to a recessed shape in which both side sections are made higher than a central section, a frame hold-down 4 is floated from the heating block 5 on the stoppage of a device, and the lead frame 1 is separated from the heating block 5. Consequently, when a wire bonder is suspended for some reason, the lead frame 1 is floated from the heating block 5, thus resulting in the difficulty of the transmission of heat over a product 3 to which bonding is completed previously, then inhibiting the thick growth of an intermetallic compound. Accordingly, the thickness of the intermetallic compound is hardly dispersed, and products having high reliability can be acquired. |
