| 发明名称 |
Copper colloid and method of activating insulating surfaces for subsequent electroplating |
| 摘要 |
A copper colloid containing a minor amount of an ionizable palladium compound for use in activating non-conductive materials for subsequent electroplating.
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| 申请公布号 |
US4762560(A) |
申请公布日期 |
1988.08.09 |
| 申请号 |
US19870132660 |
申请日期 |
1987.12.10 |
| 申请人 |
LEARONAL, INC. |
发明人 |
BRASCH, WILLIAM R. |
| 分类号 |
C23C18/30;H05K3/18;(IPC1-7):C22C9/00 |
主分类号 |
C23C18/30 |
| 代理机构 |
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