| 摘要 |
<p>CURABLE COMPOSITIONS Compositions useful as adhesives, sealants, laminating resins and coatings comprise a) an epoxide resin b) a nitrogen-containing latent curing agent for this resin, such as dicyandiamide or isophthalic acid dihydrazide and c) as accelerator for the cure, and dispersed as a powder in a) and b), a solid solution of a nitrogen base having a boiling point above 130.degree.C and a polymer of an unsaturated phanol. Typical nitrogen bases used in c) include benzyldimethylamine, 2-methylaminoethanol, isophorone diamine triethylene tetramine, and 2-methylimidazole. Typical polymeric phenols include poly(p-vinylphenol).</p> |
