| 摘要 |
PURPOSE:To provide the titled composition having excellent moisture-resistance, cracking resistance, etc., suitable for the sealing of electronic parts and composed of an epoxy resin containing a polymer produced by polymerizing a (meth)acrylate having polyfluoroalkyl group in said epoxy resin. CONSTITUTION:The objective composition is composed of an epoxy resin (preferably a resin containing grafting points preparatorily introduced into the resin using a monomer reactive with an epoxy resin) containing a polymer having polyfluoroalkyl group and produced by polymerizing a (meth)acrylate having polyfluoroalkyl group in said epoxy resin. The ratio of the epoxy resin to the polymer of (meth)acrylate having polyfluoroalkyl group is preferably 50:50-95:5. The objective composition has excellent wire-bonding adhesivity and gives a cured product having low residual stress.
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