发明名称 MOUNTING METHOD FOR CHIP COMPONENT
摘要 PURPOSE:To make it possible to mount chip components with certainty by a method wherein a stopper is projected by a faulty chip signal according to electric characteristic inspection at an intermediate stage, the lowering of a pick and place unit in operation is limited, and the rejected chip is recovered in the meantime. CONSTITUTION:An intermediate stage 8 is provided against collets 3 and 4 provided on an arm, and the inspection of electric characteristics of a diode chip 5 can be performed by said intermediate stage 8. At that time, a pick and place unit, which is constituted in a manner that it can be vertically moved by a cam in accordance with the detected reject signal, is retained at a rotatable upper position by the projection of a stopper 9 until arms A1 and B2 of the next cycle reach the position the same as the previous cycle. Accordingly, the arms A1 and B2 do not come down to a chip feeding position, an intermediate stage 8 and a mounting position during the above-mentioned operation, and when the detection of a rejected chip is performed, no rejected chip is detected, and the unnecessary vertical movement of the arms A1 and B2 can be limited. Consequently, rejected chips can be selected by type by moving forward reject pots 6 and 7, and they can be put in the reject pots 6 and 7.
申请公布号 JPS63190347(A) 申请公布日期 1988.08.05
申请号 JP19870023142 申请日期 1987.02.03
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KASHIWABARA TAKAO
分类号 H01L21/52 主分类号 H01L21/52
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