MEASUREMENT OF HEAT DISTRIBUTION OR THERMAL RESISTANCE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To enable the heat conduction process and the thermal resistance to be measured easily by a method wherein multiple wiring layers are formed on a semiconductor substrate to supply specified wiring layers with power to be consumed for measurement of the change of resistance the other wiring layers. CONSTITUTION:The heat distribution and the thermal resistance of a semiconductor device are measured by a method wherein multiple wiring layers are formed on a semiconductor substrate and then specified wiring layers among them are supplied with power to be consumed for measurement of the change of resistance in the other wiring layers. In other words, the heat distribution and the thermal resistance of package can be measured pretty accurately by means of changing various requirements as well as the arrangement of wiring layers on a chip of wiring layers by supplying one or multiple wiring layers formed on a silicon substrate 1 with current for power consumption to measure the change of resistance in the wiring layers. Through these procedures, the heat distribution on a chip and the temperature of upper wiring can be evaluated very easily.