| 摘要 |
PURPOSE:To make it possible to pack by stacking similar ICs in large numbers and to contrive the miniaturization of an electronic device by a method wherein the lead legs of a flat type IC are each provided with a socketlike pocket, wherein the point part of the lead leg of other IC can be inserted or fitted. CONSTITUTION:Sockets, wherein the point parts of lead legs 4, 4... can be insertingly fixed, are provided on the sides of at least two places of a flat piece like a DIP type IC or part of the lead legs 4, 4... is provided with a folded-back pocket or an embossed recessed part and so on instead of these sockets. That is, pocket parts 5, 5... made by bending mutually from both sides thereof are provided on the upper parts of the vertical wall surfaces of the inverted L-shaped lead legs 4, 4... protruded from the side surface of a housing 3 of the DIP type IC. The DIP type IC constituted in such a way can be packed by superposing other IC 7 on the upper part of an IC 6 mounted on a printed plate 1. Moreover, the DIP type IC can be packaged by stacking other IC 8 thereon if necessary.
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