| 摘要 |
PURPOSE:To enable the bottom surface region of a pellet to be directly bonded onto a circuit substrate with dissipating properties for improving the packaging yield on the circuit substrate by a method wherein the other parts excluding the bottom region of pellet connected to a film carrier are resin-sealed. CONSTITUTION:The wiring layer of pellet 3 and a metallic foil 2 are connected to a one side laminated film carrier formed of a resin film 1 and the metallic foil 2 by bumps 4 to be structured by sealing the other parts excluding the bottom surface with forming resin 5. Resultantly, a power package can be miniaturized and formed into thinner type enabling the bottom surface of pellet 3 to be directly bonded onto the circuit substrate so that the exoergic heat from the pellet 3 may be dissipated efficiently on the circuit substrate enabling the assembled pellets stored in the pellet package to be previously subjected to electrical inspection. Through these procedures, the packaging yield on the circuit substrate can be improved.
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