| 摘要 |
PURPOSE:To contrive improved adhesion between a metallic base and a heat- resistant resin layer, by forming the resin layer from a heat-resistant resin comprising an imide component having an Si group introduced into the main chain thereof. CONSTITUTION:A thermal head comprising a metallic base 1, a heat-resistant resin layer 2 provided on the base 1, a multiplicity of heat generating resistors 3 provided on the layer 2, and conductors connected to the resistors. The resin layer 2 comprises an imide component having an Si group introduced into the main chain thereof. The resin can be obtained by, for example, synthesizing a polyamic acid serving as a precursor of a polyamide resin through a ring- opening polyaddition reaction from an equimolar mixture of a diamine component and a tetracarboxylic acid component, while using bisaminodisiloxane as a portion of the diamine component. The amount of the diamine having the Si group is desirably at most 10 mol% based on the total amount of the diamine components. By this method, adhesion between the resin layer 2 and the base 1 is enhanced. |
