| 摘要 |
A method of selective plating a component, which method comprises contacting a lower face of the component with a contoured lower mask having a plating aperture so as to expose an area of the component to be plated, positioning the component over a plating tank and selective plating the component with a plating medium, wherein the cross-sectional area of the plating aperture is enlarged at the surface of the component so as to define one or more cavities in which the plating rate is lower than elsewhere in the plating aperture. |
