发明名称 MOUNTING STRUCTURE OF LEAD FRAME OF PACKAGE FOR SEMICONDUCTOR ELEMENT
摘要 <p>PURPOSE:To increase the mechanical strength of connection by equalizing the width U of a metallized wiring and the width W of a lead frame, forming a pectinate notch in width W to a ceramic board and brazing the lead frame at three surfaces. CONSTITUTION:A metallized wiring 3 in the same wire width U is shaped to a first ceramic board 1. Pectinate notches 8 are formed at the end side of a second ceramic board 2 only by the number of lead frames in the vertical direction. The notch 8 consists of three vertical walls. The width Q of the notch 8 is approximately equal to that U of the metallized wiring. Width Q is approximately the same as that W of the lead frame 4. Accordingly, W and U are approximately equal, thus reducing the variation of characteristic impedance in the section. Since impedance is matched, reflection is hardly generated in the section.</p>
申请公布号 JPS63187658(A) 申请公布日期 1988.08.03
申请号 JP19870019812 申请日期 1987.01.30
申请人 SUMITOMO ELECTRIC IND LTD 发明人 SHIRAISHI JUNICHI;GOTO TOMOJI;OGASA NOBUO
分类号 H01L23/08;H01L23/50 主分类号 H01L23/08
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