| 摘要 |
A method of manufacturing a miniaturized multilayer ceramic capacitor having high capacitance which comprises a dielectric body of the type that the grain boundaries thereof are insulated. Multilayer chips are prepared which consist of a semiconductor ceramic material whose major constituent comprises titanate of alkaline-earth metal such as Ba, Sr or the like; and such chips are placed within a container formed of a fired mixture of CuO and Al2O3 and subjected to a heat treatment so that copper ions which serve as insulating agent, are caused to uniformly diffuse from vapor phase in crystal grain boundaries of the semiconductor ceramics body of each of the chips. |
