| 摘要 |
PURPOSE:To obtain the title composition which provides excellent adhesion between a metallic foil and a synthetic resin film, and has excellent electrical insulating properties, heat resistance, and solvent resistance, by mixing an epoxy resin based on a dimer acid, a resin containing imido groups, and a diene rubber. CONSTITUTION:100pts.wt. epoxy resin based on a dimer acid is mixed with 50-150pts.wt. resin containing imido groups (e.g., a polyaminobismaleimide resin) and 5-80pts.wt. diene rubber (e.g., an acrylonitrile/butadiene rubber), and the formed mixture is kneaded at 40-80 deg.C for 1-30hr to give an adhesive composition for flexible printed circuit boards. A 10-70wt.% solution of this composition in an organic solvent (e.g., 1,4-dioxane) is applied to a metallic foil or synthetic resin film, which is dried to vaporize the solvent and the composition is precured. The metallic foil and synthetic resin film are then heated for contact bonding to each other.
|
