发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To contrive to be able to shorten an operating time without using such an external apparatus as an oscilloscope by a method wherein a wire bonding device is designed in such a constitution that when wire bonding conditions are inputted, the conditions are displayed graphically by a monitor simultaneously with the input and whether there is any mistake about the input can be checked. CONSTITUTION:Bonding conditions of a Z-displacement (the curve of a bonding tool) 50, upper and lower clamper solenoid action commands 51 and 52, a damper solenoid action command 53 and so on are inputted in a central control part 11 by an input unit, which is not shown in the diagram. Thereby, these bonding conditions are displayed on a monitor 15. Accordingly, an operator can easily confirm whether there is any mistake about the input. As a wire bonding device is so designed as to make the bonding conditions display on the monitor 15 in such a way, the operator sets the bonding conditions each time a type varies and there is no need to check each time whether the bonding conditions set by an oscilloscope are proper or not. Therefore, the operating time can be significantly saved.
申请公布号 JPS63186436(A) 申请公布日期 1988.08.02
申请号 JP19870017300 申请日期 1987.01.29
申请人 TOSHIBA CORP 发明人 YAMAGUCHI MASAYOSHI
分类号 H01L21/60 主分类号 H01L21/60
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