| 摘要 |
PURPOSE:To enable the cost to be reduced by providing the electrical connection between the internal wiring on a ceramic substrate and the pin for external connection by the wiring provided on the side of the substrate, thereby simplifying the structure and enabling the number of the manufacturing processes to be reduced. CONSTITUTION:In a ceramic package for optical digital link wherein a ceramic substrate 1 is sealed with a metal cap 2, a wiring 6 is provided on the side of the substrate for electrically connecting an internal wiring 4 on the ceramic substrate 1 and a pin 5 for external connection. And, between the internal wiring 4 on the ceramic substrate 1 and the metal cap 2 for instance, an insulating protective film 7 and a rail material 3 are provided. With this, even at the time of changing the internal wiring, it is only needed to change the mask for the internal wiring and the wiring change can easily be done, so the reduction of the manufacturing cost and the shortening of the manufacturing time can be achieved, and the structure can be made simple. |
