| 摘要 |
<p>PURPOSE:To obtain a composition providing cured materials capable of reducing permeation of water, having excellent flexibility, both small coefficient of thermal expansion and mold shrinkage factor, by blending a thermosetting resin with specific cured material powder. CONSTITUTION:A composition obtained by blending (A) 100pts.wt. thermosetting resin with (B) 0.1-100pts.wt. cured material of a composition consisting of 100pts.wt. organopolysiloxane having >=10 centipoise viscosity at 25 deg.C, 0-100pts. wt. filler, 0.3-100pts.wt. curing agent and 0.1-50pts.wt. phenyl compound containing an unsaturated aliphatic group in a state wherein the component B is dispersed in a fine powder state into the component A. An epoxy resin, phenolic resin, imide resin or silicone resin is used as the component A. Mechanically ground fine powder having <=300mu average particle diameter is used as the cured material of the component B.</p> |
