发明名称 BENDING METHOD FOR LEAD OF RESIN SEALING SEMICONDUCTOR DEVICE
摘要 PURPOSE:To perform the bending of a lead in specific dimension without peeling off the resin of a resin sealing part by relatively moving a forming tool in the resin sealing part direction intersecting at right angles with the pinching direction with relatively moving it in the pinching direction of a pinching tool. CONSTITUTION:A forming roller 10 is advanced in the arrow mark direction 9, i.e., pinching direction to bend the base part of a lead 4 after pinching by a pair of pinching tools 20a, 20b the base part of the lead 4 extending from the outer side of a resin sealing part 6. The forming roller 10 is further advanced and when it reaches the position opposing to the relief part 21 of the pinching tool 20b, it is moved in the arrow mark direction 22 with advancing in the arrow mark direction 9. With this movement, the tip part side of the lead 4 is formed in a key shape along the relief part 21 of the pinching tool 20b. Thereafter, the forming roll 10 is returned to the original position and the pinching of a pair of pinching tools 20a, 20b is released to return them to their original position.
申请公布号 JPS63183723(A) 申请公布日期 1988.07.29
申请号 JP19870014151 申请日期 1987.01.26
申请人 TOSHIBA CORP 发明人 SATO TAKAYUKI
分类号 B21D5/04;H01L23/50 主分类号 B21D5/04
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