| 摘要 |
PURPOSE:To enable to realize the manufacture of the titled substrate more simply, with higher efficiency and with higher reliability by a method wherein a mask patterning is performed by using a removable non-sintered paste-shaped substance. CONSTITUTION:Cu paste is printed on asubstrate 10 consisting of alumina and after the paste was dried, a sintering is performed for forming a first layer conductor 11a. Then, insulating paste is printed on the conductor 11a as well and a thick film insulating layer 12a is formed. Then, paste 20 consisting of insulating material is performed a silk-screen printing on a conductor 11d according to a pattern excluding a blank part 17 and the paste 20 is dried. After that, processes such as a sputtering process of Ta, etc., are performed in the mixed gas of N2 and Ar, and a thin film resistor 21 consisting of Ta2N is formed on the whole surface of a multilayer substrate. Subsequently, the multilayer substrate is soaked in an organic solvent and the dried paste 20 is peeled off and removed by techniques of ultrasonic washing, etc. |
