| 摘要 |
PURPOSE:To produce the titled lead frame material having high strength and having the excellent thermal exfoliation resistance to a solder by preparing a Cu alloy contg. specific ratios of Ni, Sn, Si, Zn and Ca. CONSTITUTION:The Cu alloy contg., by weight, 1-4% Ni, 1-3% Sn, 0.15-0.8% Si, 0.1-1% Zn, 0.002-0.04% Ca and the balance consisting of Cu with inevitable impurities is prepared. Said Cu alloy has high strength of about >=60kg/mm<2> tensile strength, has the excellent thermal exfoliation resistance to solder and is suitable for the Cu alloyed lead frame material for semiconductor device.
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