| 摘要 |
<p>A socket connector (2) suitable for use in establishing interconnection to a plurality of closely spaced surface pad portions (108) of traces (106) on a circuit panel (100). This socket connector (2) is suitable for use with a high density single in-line memory module. The individual terminals (10) are edge stamped from a spring metal blank and inserted in closely spaced centerlines into cavities (50) in a housing (4). Each terminal (10) has a base (14) with a pair of cantilever beams (12, 12') extending upwardly from the base (14), each cantilever beam (12, 12') being curved at its upper end to form a shallow downwardly extending ramp edge (26, 26'). Insertion of a circuit panel (100) edgewise into the connector (2) biases the terminals (10) outwardly with the stresses primarily confined to the plane of the spring metal blank. The terminals (10) are inserted from above and positively retained within the housing (4). Low insertion forces, together with a wiping action between the terminals (10) and the surface pad portions (108) of traces (106) on the circuit panel (100) is achieved.</p> |
