| 摘要 |
PURPOSE:To dry up wafers in the environment which is not subjected to the influence of the foreign matters such as dust and the like by a method wherein the hydrophilic organic solvent such as evaporated isopropyl alcohol and the like is introduced into a drying chamber. CONSTITUTION:Heaters 13 and 14 are maintained at the temperature in the neighborhood of the boiling point of the hydrophilic organic solvent such as isopropyl alcohol and the like, and a drying chamber 10 is filled up with the vapor jetted out from a nozzle 15 into the drying chamber 10. Subsequently, the upper cover 20 of the drying device is closed, and the drying chamber 10 is brought in an airtight state. At this time, even when the wafer 11 exposed by lowering the surface A of the vapor, the circumference of the wafer is filled by the vapor of alcohol again before the temperature of the wafer 11 rises, because the vapor is sufficiently supplied from the nozzle 15. As a result, the water adhered to the surface of the wafer 11 is washed away downward by the isopropyl alcohol and the like adhered to the wafer 11 is mixed into the hydrophilic organic solvent such as isopropyl alcohol and the like adhered to the wafer, and it is washed away toward the lower part.
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