发明名称 |
AN INTEGRATED CIRCUIT MODULE TO PLANAR BOARD INTERCONNECTION SYSTEM |
摘要 |
An integrated circuit module to printed circuit board interconnection system wherein the board has circuit pads to which spring contacts have one of their ends soldered to the pads. The module has circuit pads on one surface thereof and a pivotal connection is provided for loading the module onto the circuit board whereby the opposite ends of the spring contacts engage the circuit pads on the module with a wiping action and are retained in engagement therewith. |
申请公布号 |
EP0147519(B1) |
申请公布日期 |
1988.07.27 |
申请号 |
EP19840109399 |
申请日期 |
1984.08.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BABUKA, ROBERT;PIECHOTA, JOHN LAWRENCE;POCH, LEONARD JOHN |
分类号 |
H01L23/32;H01R33/76;H05K3/32;H05K7/10 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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