| 摘要 |
PURPOSE:To obtain a photosensitive coating compsn. which gives a protective film having a sufficient hardness and excellent adhesion to solder, by blending a photosensitive material with a finely divided aluminosilicate. CONSTITUTION:A compsn. contains a photosensitive material and at least 5wt.% (based on the amount of the photosensitive material) finely divided alu minosilicate. As the photosensitive material, any of a monomer and its prepolymer can be used. Preferred photosensitive epoxy resins are those having ethylenically unsaturated bonds capable of undergoing an addition reaction or a polymn. reaction by irradiation with actinic rays and curable epoxide groups and contg. a curing agent and a curing accelerator. When the amount of the aluminosilicate is less than 5wt.% based on that of the photosensitive material, any protective film having excellent adhesion and hardness can be formed. The silicate has an average particle size of pref. 0.1-10mum.
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