发明名称 |
COOLING OBJECTS, FOR EXAMPLE SEMICONDUCTOR DEVICES |
摘要 |
<p>A heat transfer medium having a composition such that it is in the form of a phase mixture of solid and liquid phases at the appropriate temperature. The phases may be a solid solution and a liquid mixture of two or more components, providing the medium as a metal sherbet. For instance, in an In-Ga binary system solids of In-Ga solid solution are dispersed in an In and Ga liquid. The medium (4) may be placed between a cooling unit (6) and an object, e.g. a semiconductor device (2), to be cooled, exhibiting the solid and liquid phase mixture form at the normal operating temperature of the device and cooling unit.</p> |
申请公布号 |
EP0264892(A3) |
申请公布日期 |
1988.07.27 |
申请号 |
EP19870115294 |
申请日期 |
1987.10.19 |
申请人 |
FUJITSU LIMITED |
发明人 |
NATORI, KATSUHIDE FUJITSU LTD. KOSUGI FUJITSU B.;WATANABE, ISAO FUJITSU LTD. KOSUGI FUJITSU B.;KATSUYAMA, KOJI FUJITSU LTD. KOSUGI FUJITSU B.;KAWAMURA, ISAO FUJITSU LTD. KOSUGI FUJITSU B.;YAMAMOTO, HARUHIKO FUJITSU LTD. KOSUGI FUJITSU B.;NAGAI, TAKESHI FUJITSU LTD. KOSUGI FUJITSU B. |
分类号 |
H01L23/373;H01L23/36;H01L23/427;H01L23/473;(IPC1-7):H01L23/42 |
主分类号 |
H01L23/373 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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