| 摘要 |
PURPOSE:To improve workability, by a method wherein semiconductor chips are cut off and arranged on a tape every several pieces, and a test is performed by setting them on a substrate for acceleration test. CONSTITUTION:Semiconductor chips 4 are cut off and arranged on a tape 1 every groups having a specified number and length, and set on sockets 6 of a substrate 5 for acceleration test. In this case, the sockets 6 arranged in a transversal row are rotated against the substrate 5 as if a lid is opened, and prepared to set the tape 1. After the tape 1 is arranged at a specified position of the substrate 5, the sockets 6 are rotated and set on the semiconductor chips 4. On the bottom surface of the socket 6, a plurality of measuring terminals protrude, which are brought into contact with a measuring pad on the tape 1. When an acceleration test is finished, the tape 1 is taken off from the substrate 6, and the tapes for which the test is finished are connected by applying an adhesive tape. Workability is improved, thereby.
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