发明名称 |
MOUNTING DEVICE FOR SEMICONDUCTOR LASER |
摘要 |
PURPOSE:To mount a semiconductor laser chip to a screening device without fitting it to a stem by preparing a groove where a semiconductor laser chip is arranged as well as a terminal where the semiconductor laser chip is fixed in the groove. CONSTITUTION:A groove 14 is formed between both sides of a semiconductor laser chip 11. The semiconductor laser chip 11 is placed in the groove 14 and its chip 11 is attached between a heat sink 12 and a terminal 15 using pressure by tightening a screw of its terminal 15 having a spring property. Thus the semiconductor laser chip 11 is mounted to a screening device without equipping a stem with its chip 11 by arranging the groove 14 and terminal 15 to which the semiconductor laser chip 11 is fixed.
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申请公布号 |
JPS63181490(A) |
申请公布日期 |
1988.07.26 |
申请号 |
JP19870014663 |
申请日期 |
1987.01.23 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
ABE TOMOKO;KASAHARA MASAO |
分类号 |
H01S5/00 |
主分类号 |
H01S5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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