发明名称 MOUNTING DEVICE FOR SEMICONDUCTOR LASER
摘要 PURPOSE:To mount a semiconductor laser chip to a screening device without fitting it to a stem by preparing a groove where a semiconductor laser chip is arranged as well as a terminal where the semiconductor laser chip is fixed in the groove. CONSTITUTION:A groove 14 is formed between both sides of a semiconductor laser chip 11. The semiconductor laser chip 11 is placed in the groove 14 and its chip 11 is attached between a heat sink 12 and a terminal 15 using pressure by tightening a screw of its terminal 15 having a spring property. Thus the semiconductor laser chip 11 is mounted to a screening device without equipping a stem with its chip 11 by arranging the groove 14 and terminal 15 to which the semiconductor laser chip 11 is fixed.
申请公布号 JPS63181490(A) 申请公布日期 1988.07.26
申请号 JP19870014663 申请日期 1987.01.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ABE TOMOKO;KASAHARA MASAO
分类号 H01S5/00 主分类号 H01S5/00
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